The New Graduate College candidate will join the GlobalFoundries Technology and Innovation organization to support 3D packaging and system co-optimization research and development. The candidate will have a 3 year local contract assignment at IMEC in Leuven, Belgium with a path to Malta, NY (USA). During the 3 years assignment at IMEC the candidate is expected to support GlobalFoundries technology development focus within the IMEC Industrial Affiliation Programs in 3D Packaging and Cross-system Technology Co-development, including hands‑on experiments, integration and system analysis. Additionally, the person will organize and lead joint‑development projects at IMEC for learning and technology transfer to respective GlobalFoundries R&D teams. Post doc candidates are welcome to apply.
Your Job
Learn and transfer 3D‑Heterogeneous Integration steps (direct die to wafer bonding, wafer to wafer hybrid wafer bonding and others) from IMEC Program to internal GF R&D.
Learn the system architecture and their requirements to develop expected 3D pkg solutions.
Own and drive bi‑lateral projects between Globalfoundries and IMEC.
Build and maintain relationships with semiconductor 3D material and tooling vendors.
Contribute to Intellectual Property by writing innovative invention disclosures.
Contribute to publications and conferences with scientific results.
Understand application domains for 3D pkg like Artificial Intelligence, Silicon Photonics transceiver/interposer and RF interposers.
Understand from IMEC 3D pkg ecosystem the pathfinding areas for new materials (e.g. slurries for CMP, III‑Vs etc) and new integration schemes e.g. die detachment or die‑to‑die bonding.
Other Responsibilities
Support preparation of summaries and program feedbacks to IMEC after Partner Technical Weeks (April, October).
Contribute to Executive Read Outs from IMEC.
Initiate and run Technical Update sessions in particular technical domains of interest.
Scout 3D program elements that are ready for technology transfer to Globalfoundries, e.g. simulation models or design platforms.
Required Qualifications
Education – technology‑related degree (PHD preferred) in Physics, Electrical Engineering, Chemistry, Computer Engineering, Materials Science, Chemical Engineering or other related engineering or physical sciences disciplines.
Fluent in Microsoft Office applications: MS Excel, MS Word, MS PowerPoint, Outlook, Teams.
Ability to work effectively and efficiently with diverse teams, customers, internal and external partners.
Language Fluency - English (Written & Verbal).
Excellent interpersonal skills, energetic and self‑starter. Demonstrated ability to use these attributes in conflict resolution if required.
Demonstrated ability to efficiently solve problems and provide clear guidance on critical decisions.
Preferred Qualifications
Systems partitioning expertise for optimization of product form factor for performance, definition of interconnect strategy (Heterogeneous Integration, electrical D2D, broadband surface coupling, etc.) to guide technology development and partner selection (Corporations, Universities and/or Research Institutes).
Design of electrical test structures for interconnect and package.
Project management skills – the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
Information about our benefits you can find here: https://gf.com/careers/opportunities-in-europe/
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