We are looking for a development engineer focused on Die-to Wafer (D2W) bonding to strengthen the MAterial Transfer (MAT) team.
What you will do
D2W bonding is becoming increasingly critical in advanced device integration, heterogeneous integration, and exploratory technology platforms. This bonding process also enables the integration of non-standard materials, such as III/V compounds (e.g. InP), diamond, … onto silicon wafers, opening new pathways for performance, thermal management, and novel device concepts.
As a member of the MAterial Transfer (MAT) team, you will develop and optimize D2W bonding processes for these challenging new materials. Your work will mainly take place in the cleanroom, and you will collaborate closely with R&D engineers and process experts to design, execute, and analyse bonding experiments. You will work in a dynamic multidisciplinary and multicultural environment in cooperation with researchers, engineers, operations, equipment vendors, device and process experts. As a D2W boding process engineer, you will be essential in helping to achieve the team's goals and technology milestones. More specifically, you will:
* Organize and execute process development activities for D2W bonding process steps. This comprises the definition and optimization of bonding flows including surface preparation, bonding, and post-bond anneal steps.
* Validate bonding quality using relevant metrology (e.g., void detection, bond strength, surface/interface characterization).
* Summarize results and propose next steps, reporting progress, challenges, and opportunities to the different stakeholders.
* Take a significant hands-on role in the cleanroom, sharing ownership of the bonding processes and continuously increasing their maturity and robustness.
* Work across team boundaries with integration, hardware, and support teams. Being a strong team player is essential.
What we do for you
We offer you the opportunity to join one of the world's premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you'll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.
We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.
Who you are
* You have a Master's degree in Physics, Chemistry, Materials Science, Engineering, or equivalent through experience.
* You are eager to work hands-on in a cleanroom environment.
* You are analytical, innovative, self-motivated and solution-oriented, with a strong focus on high-quality results.
* You are organized and have a logical and methodical working style.
* Given the international character of imec, good knowledge of spoken and written English is required.
* You enjoy working in a team environment, while being able to operate independently when needed.
* Experience with bonding technologies (wafer bonding, thin-film transfer, hybrid/fusion bonding, etc.) is considered a strong plus.
* Experience with III/V, diamond, wide-bandgap materials… and their surface chemistry or integration challenges is a plus.
* Familiarity with semiconductor processing areas (CMP, cleaning, plasma treatments, annealing, etc.) is an asset.
* Data analysis and/or modelling skills (e.g., Matlab, Python, Comsol…) are a plus.
* Experience with bonding metrology or interface characterization is considered a plus.