3D Integration Program Director – Lead Innovation in Telecom & AILocation: Leuven, Belgium Are you an expert in 3D integration, semiconductor manufacturing, and cutting-edge materials? Ready to drive innovation in AI, 5G, and next-gen networking? We’re looking for a 3D Integration Program Director to lead high-impact R&D projects that shape the future of telecom and beyond! What You’ll Do:- Lead breakthrough projects in AI/CPU, networking, and 3D engineering. - Design and implement cutting-edge 3D engineering architectures. - Turn complex ideas into reality by managing risks and executing technical roadmaps. - Collaborate globally with top industry experts to push the boundaries of 3D technologies. - Apply your expertise in 3D IC, advanced packaging, chip stacking, and semiconductor tech. What You Bring: - PhD in Engineering, Materials Science, or a related field. - 10+ years of experience in 3D integration, semiconductor manufacturing, or advanced materials. - Deep knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stacking. - Strong leadership & communication skills to work with top-tier researchers and engineers. - A problem-solving mindset with the ability to manage complex, high-stakes projects. Why Join Us?- Work at the forefront of innovation in AI, 5G, and advanced networking. - Collaborate with global experts and lead game-changing research. - Be part of a company driving next-gen digital transformation. Are you ready to lead the future of 3D integration? Apply now and let’s innovate together!