Huawei Technologies Research and Development Belgium NV is a center of excellence for silicon photonics. Driven by AI applications, silicon photonics technology is playing an important role in current and next generation optical communication. Caliopa department, which is located in Gent, is the core team providing advanced silicon photonic chip solutions and novel design methods to enhance the competitiveness of the opto-electronics business in Huawei. To strengthen our team, we are now looking for a Photonics Design Expert. Job responsibilities: Gain insights into the development trends in the optical communication field and build the continuous competitiveness of silicon photonics technology in short-reach optical interconnects and coherent optical communications Lead new concept studies as well as product development projects from R&D stage toward new products introduction (NPI) Guide the definition of complex silicon photonics chip architectures and achieve best in class performance of active and passive components Lead the optoelectronic co-design towards modulators and detectors as well as the respective driver and TIA. Further, lead the optimization of the overall optoelectronic systems using 2.5D/3D advanced packaging to ensure high-speed signal integrity Work as part of a team of photonic engineers and product designers dedicated to develop Huawei’s silicon photonics device and product portfolio Work closely with solution, process, and packaging teams to ensure the implementation of the architecture and key technologies Requirements & Qualifications: In depth knowledge of integrated optics and optoelectronics components Education requirements: Prefer Ph.D. or equivalent in Photonics, Electrical Engineering, Physics, or related field, and 5 years of work experience in the photonics industry Experience requirements: Design and test of silicon photonics with successful product development experience (spec. definition, yield improvement strategies, customer-oriented attitude, business acumen for new business opportunities) Working knowledge of how to integrate PICs with EICs, RF ICs, and driving circuitry in transceiver modules or equivalent sub-system applications Deep understanding of silicon photonics technology trends and the ability to identify key directions in silicon photonics technology Experience in high-density optoelectronic integration with 2.5D/3D advanced packaging and co-design of optoelectronic chips is preferred Proven track record of project/product management skills, bringing new components or systems to market in volume production Experience in effective communication with stakeholders to secure internal funding for new R&D projects as well as market/business landscape analysis Hands on experience with photonics modelling tools Experience with Luceda Ipkiss, Python, VPI software etc. would be an advantage Language: Fluent in English (written and spoken) Attitude: Strong team player Excellent written and oral communication skills Creativity in problem-solving Customer centric Proactive