Position Overview
As an Advanced Package Design Engineer, your task is to optimize the design of integrated circuit (IC) packages to enhance performance, reliability, and manufacturability. You will work on high-speed devices with demanding electrical and integration requirements, contributing to advanced 2.5D/3D packaging solutions.
Responsibilities
Package Selection and Analysis
* Select appropriate IC package types based on device specifications and system requirements.
* Analyze electrical, thermal, and mechanical characteristics of the selected package.
* Identify design limitations, risks, and improvement opportunities early in the development phase.
Electrical Performance Optimization
* Optimize signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC).
* Analyze routing, parasitics, impedance control, crosstalk, and noise behavior.
* Propose and implement design enhancements to improve high-speed performance.
Design for Manufacturability and Cost Optimization
* Ensure package design compatibility with manufacturing processes and assembly requirements.
* Review materials, stack-up choices, and routing density for cost and yield optimization.
* Support efficient production while maintaining performance and reliability targets.
Documentation and Reporting
* Prepare comprehensive technical documentation including simulations, calculations, and design justifications.
* Clearly communicate analysis results and optimization recommendations to cross-functional teams.
Who You Are
* MSc in the field of electronics & equivalent or at least 2 years of experience in packaging design as well as SIPI analysis
* Knowledge in Cadence layout tool
* Knowledge in Ansys tool
* Knowledge in 2.5D/3D packaging, backend silicon layout (place & route)
* To be able to communicate in English is a must