Our client, a leading telecom solutions provider, is seeking a talented 3D Integration Program Director to join their dynamic R&D team. This is an exciting opportunity to work at the forefront of innovation in telecom, AI, 5G, and networking, collaborating with global experts to shape the future of technology.Role DescriptionAs the 3D Integration Program Director, you will be responsible for leading high-impact projects in AI/CPU, networking, and other future-driven areas. You will design and implement a competitive 3D engineering architecture based on cutting-edge application scenarios, decomposing complex engineering structures into actionable plans and driving innovative research to turn technical ideas into commercial breakthroughs.Must Have SkillsPhD in Engineering, Materials Science, or a related fieldOver 10 years of experience in 3D integration, semiconductor manufacturing, or advanced materialsDeep knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stackingStrong communication skills and a collaborative mindsetExcellent analytical abilities and experience in leading complex projectsNice to Have SkillsExperience in the telecom industry or related sectorsFamiliarity with 5G and AI technologiesProven track record of successful research and development projectsJob Ref: BBBH26007Next StepsIf you're a PhD-level expert in 3D integration and ready to make an impact on the future of tech, we encourage you to apply for this exciting opportunity with our client. Submit your CV today, and one of our consultants will be in touch to discuss the next steps.Interested in this Role? Submit your CV today!Please don't hesitate to contact any of our team with any questions you may have on Email: info@allenrec.com
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