3D Integration Program Director Lead Innovation in Telecom & AI
Location: Leuven, Belgium
Are you an expert in 3D integration, semiconductor manufacturing, and cutting edge materials? Ready to drive innovation in AI, 5G, and next gen networking? Were looking for a 3D Integration Program Director to lead high impact R&D projects that shape the future of telecom and beyond!
What Youll Do:
Lead breakthrough projects in AI/CPU, networking, and 3D engineering.
Design and implement cutting edge 3D engineering architectures.
Turn complex ideas into reality by managing risks and executing technical roadmaps.
Collaborate globally with top industry experts to push the boundaries of 3D technologies.
Apply your expertise in 3D IC, advanced packaging, chip stacking, and semiconductor tech.
What You Bring:
PhD in Engineering, Materials Science, or a related field.
10+ years of experience in 3D integration, semiconductor manufacturing, or advanced materials.
Deep knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stacking.
Strong leadership & communication skills to work with top tier researchers and engineers.
A problem solving mindset with the ability to manage complex, high stakes projects.
Why Join Us?
Work at the forefront of innovation in AI, 5G, and advanced networking.
Collaborate with global experts and lead game changing research.
Be part of a company driving next gen digital transformation.
Are you ready to lead the future of 3D integration? Apply now and lets innovate together!