PROCESS ENGINEER LEUVEN (BELGIUM) PERMANENT POSITION
We''re currently recruiting a hands on Process Engineer to join a company based in Leuven, as part of their microelectronics manufacturing team.
In this role, you will be responsible for developing, optimizing, and troubleshooting assembly and packaging processes for high performance microelectronic devices. You will work directly on the production floor, ensuring process stability, yield improvement, and product quality while supporting the introduction of new technologies and automation.
This role requires a strong background in microelectronics assembly, packaging techniques, and production process optimization. You will collaborate with operators, equipment engineers, and R&D teams to ensure efficient and reliable manufacturing processes.
Key Responsibilities:
* Develop and refine assembly and packaging processes for microelectronic components, including die attach, wire bonding, flip chip bonding, encapsulation, and hermetic sealing.
* Establish and maintain process parameters, work instructions, and standard operating procedures (SOPs) to ensure consistent production quality.
* Identify and implement continuous improvement initiatives, focusing on process stability, efficiency, and cost reduction.
* Provide hands on support for daily production activities, ensuring minimal downtime and high yield.
* Analyze process failures, defects, and yield loss, identifying root causes and implementing corrective actions.
* Work closely with equipment engineers and operators to ensure smooth operation of assembly and packaging tools.
* Collaborate with equipment teams to qualify, maintain, and optimize production equipment.
* Evaluate and qualify materials, adhesives, and bonding agents to ensure compatibility with production processes.
* Support automation initiatives to enhance process repeatability and throughput.
* Work with quality teams to investigate non conformances and implement corrective actions.
Qualifications & Skills:
1. Bachelors or Masters degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
2. 3+ years of hands on experience in microelectronics assembly, packaging, or semiconductor manufacturing.
3. Strong knowledge of die attach, wire bonding (gold, copper, aluminum), flip chip, epoxy dispensing, and encapsulation techniques.
4. Experience with manufacturing process optimization, SPC, DOE, and failure analysis.
5. Hands on experience with bonding, dicing, pick and place, reflow soldering, or cleanroom processes.
6. Familiarity with automation, robotics, and lean manufacturing principles is a plus.
7. Strong problem solving and analytical skills, with a proactive, hands o