PpThe New Graduate College candidate will join the GlobalFoundries Technology and Innovation organization to support 3D packaging and system co-optimization research and development. The candidate will have a 3 year local contract assignment at IMEC in Leuven, Belgium with a path to Malta, NY (USA). During the 3 years assignment at IMEC the candidate is expected to support GlobalFoundries technology development focus within the IMEC Industrial Affiliation Programs in 3D Packaging and Cross-system Technology Co-development, including hands‑on experiments, integration and system analysis. Additionally, the person will organize and lead joint‑development projects at IMEC for learning and technology transfer to respective GlobalFoundries RD teams. Post doc candidates are welcome to apply. /p h3Your Job /h3 ul liLearn and transfer 3D‑Heterogeneous Integration steps (direct die to wafer bonding, wafer to wafer hybrid wafer bonding and others) from IMEC Program to internal GF RD. /li liLearn the system architecture and their requirements to develop expected 3D pkg solutions. /li liOwn and drive bi‑lateral projects between Globalfoundries and IMEC. /li liBuild and maintain relationships with semiconductor 3D material and tooling vendors. /li liContribute to Intellectual Property by writing innovative invention disclosures. /li liContribute to publications and conferences with scientific results. /li liUnderstand application domains for 3D pkg like Artificial Intelligence, Silicon Photonics transceiver/interposer and RF interposers. /li liUnderstand from IMEC 3D pkg ecosystem the pathfinding areas for new materials (e.g. slurries for CMP, III‑Vs etc) and new integration schemes e.g. die detachment or die‑to‑die bonding. /li /ul h3Other Responsibilities /h3 ul liSupport preparation of summaries and program feedbacks to IMEC after Partner Technical Weeks (April, October). /li liContribute to Executive Read Outs from IMEC. /li liInitiate and run Technical Update sessions in particular technical domains of interest. /li liScout 3D program elements that are ready for technology transfer to Globalfoundries, e.g. simulation models or design platforms. /li /ul h3Required Qualifications /h3 ul liEducation – technology‑related degree (PHD preferred) in Physics, Electrical Engineering, Chemistry, Computer Engineering, Materials Science, Chemical Engineering or other related engineering or physical sciences disciplines. /li liFluent in Microsoft Office applications: MS Excel, MS Word, MS PowerPoint, Outlook, Teams. /li liAbility to work effectively and efficiently with diverse teams, customers, internal and external partners. /li liLanguage Fluency - English (Written Verbal). /li liExcellent interpersonal skills, energetic and self‑starter. Demonstrated ability to use these attributes in conflict resolution if required. /li liDemonstrated ability to efficiently solve problems and provide clear guidance on critical decisions. /li /ul h3Preferred Qualifications /h3 ul liSystems partitioning expertise for optimization of product form factor for performance, definition of interconnect strategy (Heterogeneous Integration, electrical D2D, broadband surface coupling, etc.) to guide technology development and partner selection (Corporations, Universities and/or Research Institutes). /li liDesign of electrical test structures for interconnect and package. /li liProject management skills – the ability to innovate and execute solutions that matter; the ability to navigate ambiguity. /li /ul pInformation about our benefits you can find here: /p /p #J-18808-Ljbffr